The ECHO scanning acoustic microscope is a nondestructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in the lab or on the production floor.

Product Details: 

This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.

A robust, universal, ultrasonic flaw detector for overmolded single-die packages, bare flip chips and other standard

●  applications

●  Imaging of defects as small as 10 microns

●  Transducers from 15MHz through 200MHz, designed and matched in-house to address all types of applications and materials

●  Stacked Die Imaging (SDI) (optional)

●  Molded Flip Chip Imaging (MFCI) (optional)

Product Literature

File NameLanguageDate updatedFile Size

Sonix Overview Brochureen-US10-20123.65 MB